A new technical paper titled “Patterned Multi-Wall Nanosheet FETs for Sustainable Scaling: Zero Gate Extension With Minimal ...

The next big leap in semiconductor packaging will require a slew of new technologies, processes, and materials, but collectively they will enable orders of magnitude ...

The semiconductor industry has spent decades mastering the art of integrated circuit physical verification. But as system-on-chip (SoC) designs push the boundaries of complexity—with more transistors, ...

In the rapidly evolving world of ASIC design, the shift from monolithic to 2.5D and 3D multi-die architectures represents a significant leap forward. This approach, which integrates multiple chiplets ...

A new technical paper (preprint) titled “Extreme Ultraviolet and Beyond Extreme Ultraviolet Lithography using Amorphous ...

DAC's AI focus; 300mm fab report; foundry revenue; new auto chip org.; Micron earnings; rare earth exports plummet; UK's tech ...

Disaggregration requires traffic cops and in-chip monitors to function as expected over time. The shift from SoCs to ...

Ensuring trusted execution across multiple chiplets and vendors is more complex than in traditional monolithic SoCs.

An Agentic Approach for SoC Security Verification using Large Language Models” was published by researchers at University of ...

AI requires a lot of data, particularly for training models. The problem is that planar chips are unable to process all that ...

A new technical paper titled “Exploring optimal TMDC multi-channel GAA-FET architectures at sub-1nm nodes” was published by ...

Researchers from the University of Massachusetts Amherst created silicon-based in-sensor visual processing arrays that can ...