A new technical paper titled “Patterned Multi-Wall Nanosheet FETs for Sustainable Scaling: Zero Gate Extension With Minimal ...

Ensuring trusted execution across multiple chiplets and vendors is more complex than in traditional monolithic SoCs.

A new technical paper (preprint) titled “Extreme Ultraviolet and Beyond Extreme Ultraviolet Lithography using Amorphous ...

DAC's AI focus; 300mm fab report; foundry revenue; new auto chip org.; Micron earnings; rare earth exports plummet; UK's tech ...

Disaggregration requires traffic cops and in-chip monitors to function as expected over time. The shift from SoCs to ...

An Agentic Approach for SoC Security Verification using Large Language Models” was published by researchers at University of ...

AI requires a lot of data, particularly for training models. The problem is that planar chips are unable to process all that ...

Researchers from the University of Massachusetts Amherst created silicon-based in-sensor visual processing arrays that can ...

Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration” was published by researchers at Yokohama National University, ...

Creating high-quality and high-performance autonomous and connected vehicles while mitigating safety risks across their ...

D-IC trends and challenges; virtual prototypes for SDVs; chiplet security; sustainable AI development; quality best practices ...

Hardware Trojans Detection Using GNN in RTL Designs” was published by researchers at University of Connecticut and University of Minnesota. Abstract “hip manufacturing is a complex process, and to ...