A new technical paper titled “Patterned Multi-Wall Nanosheet FETs for Sustainable Scaling: Zero Gate Extension With Minimal ...

In the rapidly evolving world of ASIC design, the shift from monolithic to 2.5D and 3D multi-die architectures represents a significant leap forward. This approach, which integrates multiple chiplets ...

A new technical paper (preprint) titled “Extreme Ultraviolet and Beyond Extreme Ultraviolet Lithography using Amorphous ...

DAC's AI focus; 300mm fab report; foundry revenue; new auto chip org.; Micron earnings; rare earth exports plummet; UK's tech ...

Ensuring trusted execution across multiple chiplets and vendors is more complex than in traditional monolithic SoCs.

Disaggregration requires traffic cops and in-chip monitors to function as expected over time. The shift from SoCs to ...

AI requires a lot of data, particularly for training models. The problem is that planar chips are unable to process all that ...

Opinion: The foundry makes all of the logic chips critical for AI data centers, and might do so for years to come.

An Agentic Approach for SoC Security Verification using Large Language Models” was published by researchers at University of ...

Researchers from the University of Massachusetts Amherst created silicon-based in-sensor visual processing arrays that can ...

Just because the various components in an advanced package work individually and together doesn't guarantee they will work ...

Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration” was published by researchers at Yokohama National University, ...