Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...
The miniaturization trend in electronic devices and the rise in smart and IoT device segments make adopting heterogeneous integration of chip components or 3D-ICs a viable option for miniaturization ...
San Jose, CA. Cadence Design Systems Inc. has announced its Cadence Sigrity 2018 release, which includes new 3D capabilities that enable PCB design teams to accelerate design cycles while optimizing ...
Multi-scale 3D CT imaging enables digital twinning, high-fidelity simulation of composite structures
Paul Compston, CEO and director; Silvano Sommacal, technical lead, Advanced Diagnostics Division; and John Holmes, senior engineer, New Frontier Technologies Shown here is the laser tape placement ...
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