A technical paper titled “DRAM Translation Layer: Software-Transparent DRAM Power Savings for Disaggregated Memory” was published by researchers at Seoul National University. Abstract: “Memory ...

NEO Semiconductor, a leading developer of breakthrough memory technologies, today introduced the world's first Extreme High Bandwidth Memory (X-HBM) architecture for AI chips. Built to meet the ...

The NorthPole chip developed by IBM brings memory and processing together, allowing vast improvements in image recognition and other computing tasks Credit: IBM Corp. A brain-inspired computer ...