Electric-field-assisted assembly enables scalable, lithography-free fabrication of logic circuits using 2D semiconductors. It ...

However, even high-quality 2D materials can have atomic defects, like missing sulfur or selenium atoms, which affect ...

A new technical paper titled “Experimental Verification and Evaluation of Non-Stateful Logic Gates in Resistive RAM” was published by researchers at RWTH Aachen University and Forschungszentrum Jülich ...

Before we plunge headfirst into the fray with gusto and abandon (and aplomb, of course), let’s remind and reassure ourselves that—although the following discussions focus on the devices and ...

Why it matters: For decades, scientists have dreamed of building computer chips that use light instead of electricity to process information. While our current silicon chips are incredibly fast, ...

A new technical paper titled “Flip-Lock: A Flip-Flop-Based Logic Locking Technique for Thwarting ML-based and Algorithmic Structural Attacks” was published by researchers at TU Dresden and Ruhr ...

I fear the topic of this column is poised to unleash a tsunami of controversy. My engineering accomplice Joe Farr says that this is one of those topics that, when presented to 10 different engineers, ...