SINGAPORE — ST Assembly Test Services Ltd. has expanded its portfolio of solutions for wireless applications with the addition of Land Grid Array (LGA). The LGA is a laminate substrate-based, fine ...
Low-Profile Package Provides Enhanced Performance and Flexibility for Mission-Critical Military and Aerospace Designs MOUNTAIN VIEW, Calif., July 7 /PRNewswire ...
Murata Power Solutions has added the OKL-T/1-W12 to its Okami series of point of load (PoL) DC-DC converters for embedded applications. The OKL-T/1-W12 is designed in an iLGA (inspectable land grid ...
Analog Devices, Inc. announced today production release of its 44 GHz single-pole, double-throw (SPDT) switches, the ADRF5024 and ADRF5025 in advanced Silicon-on-Insulator (SOI) technology. The two ...
Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of ...
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