EDN

Stats expands wireless options with Land Grid Array

SINGAPORE — ST Assembly Test Services Ltd. has expanded its portfolio of solutions for wireless applications with the addition of Land Grid Array (LGA). The LGA is a laminate substrate-based, fine ...
Design-Reuse

Actel Introduces Land Grid Array Packaging Option for Radiation-Tolerant RTAX-S FPGA Family

Low-Profile Package Provides Enhanced Performance and Flexibility for Mission-Critical Military and Aerospace Designs MOUNTAIN VIEW, Calif., July 7 /PRNewswire ...
Semiconductor Engineering

WLFO For High-Performance Low-Cost Packaging Of RFMEMS-CMOS

Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of ...
The Engineer

Analog Devices’ 44 GHz Silicon Switches Offer Industry’s Lowest Insertion-Loss in Compact Land Grid Array Package

Analog Devices, Inc. announced today production release of its 44 GHz single-pole, double-throw (SPDT) switches, the ADRF5024 and ADRF5025 in advanced Silicon-on-Insulator (SOI) technology. The two ...
Semiconductor Engineering

Wafer-Level Fan-Out For High-Performance, Low-Cost Packaging Of Monolithic RF MEMS/CMOS

Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of ...
Neowin

Noctua announces full list of AM4 coolers compatible with AM5 and Ryzen 7000 (Zen 4)0 0

With the next-gen socket AM5, AMD is departing from pin grid array (PGA) and moving to land grid array (LGA) on its mainstream chips. However, the move to a new socket with different orientation doesn ...