Video system design goes beyond evaluating and using the right microprocessors, peripheral chips and other related components. Consider that high-pin count, fine-pitch BGAs ranging upwards of 1,052 ...

This is the eleventh article in a series about my career experiences in the PCB design industry. During my relatively long employment at Mentor Graphics, I worked on many different projects. This ...

Editor's note: This article addresses the need for designers of printed circuit boards for nextgen ICs to be savvy about package-on-package technology. New ways of working with sub-assembly printed ...

Several tools now combine MCAD and ECAD in one simulation platform to facilitate analysis of ever-more-complex boards, as well as reduce overhead and potential errors. Higher-speed connections and ...

A well-orchestrated PCB design and assembly plan is required to successfully implement techniques such as underfill in next generation OEM embedded consumer and mobile designs. Two distinct market ...

Abstract: The ball field design in a flip chip (FC) ball grid array (BGA) often becomes the determining factor for the package body size. This paper describes the physical definition of ball fields ...

Abstract: Today's electronic products are required to be increasingly small, fast, low power, light weight and feature-rich. These requirements have been converted to the electronic domain as smaller ...

The printed circuit board (PCB) industry, like almost all in the technology sector, has experienced extraordinary growth and change since its inception in the early 20th century. Changes in component ...