ANSYS Inc.’s ANSS flagship multiphysics analysis solutions are leveraged by Faraday Technology Corporation for the development of advanced designs for modern multi-die 2.5D/3D integrated circuits (ICs ...

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...

AI-based workflows aid advanced node designs, ensuring design and system technology co-optimization for HPC and AI applications / Key Highlights TSMC and Ansys advance AI-assisted workflows to support ...

Faraday Technology Corporation will use Ansys RaptorX™ on-chip electromagnetic (EM) modeling solution to enhance the development of advanced packaging designs for 2.5D/3D integrated circuits (ICs) ...

PITTSBURGH, April 29, 2025 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These ...

Ansys announced that PathFinder-SC is certified as a new ESD analysis solution for customers designing with TSMC's N2 silicon process technology. PathFinder-SC delivers a novel verification solution ...

MOUNTAIN VIEW, Calif., April 26, 2023 /PRNewswire/ -- To accelerate development of advanced radio frequency (RF) and millimeter wave (mmWave) designs with high reliability, Synopsys, Inc. (SNPS) ...

As manufacturers struggle to keep up with demands for smaller, faster, more power-efficient high-performance electronics, one solution from Ansys and Microsoft provides relief. As wireless ...