Discover how 5D memory crystals store human DNA and biological data for billions of years, offering a breakthrough in data preservation and genetic archiving.

In the field of 5D experience halls, driven by both technological iteration and user experience, a number of core competitive ...

Consequently, 3.5D integration, which combines 3D silicon stacking with 2.5D packaging, is poised to become the technology of choice for next-generation XPUs in the coming decade. Broadcom’s 3.5D ...

Consequently, 3.5D integration, which combines 3D silicon stacking with 2.5D packaging, is poised to become the technology of choice for next-generation XPUs in the coming decade. Broadcom's 3.5D ...

Broadcom's 3.5D XDSiP platform for high-performance processors uses TSMC's CoWoS and other packaging technologies to build a system-in-packages comprising 6000mm² of 3D-stacked silicon with 12 ...

Consequently, 3.5D integration, which combines 3D silicon stacking with 2.5D packaging, is poised to become the technology of choice for next-generation XPUs in the coming decade.

Consequently, 3.5D integration, which combines 3D silicon stacking with 2.5D packaging, is poised to become the technology of choice for next-generation XPUs in the coming decade. Broadcom’s 3.5D ...

Actions Technology has adopted VeriSilicon’s 2.5D Graphics Processor Unit (GPU) IP in its Bluetooth smart watch SoC series.