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On the power side of 2.5D designs there are some extra issues that have to be considered during the design process, pointed out Steve Smith, senior director of 3D IC strategy and marketing at Synopsys ...
Several companies are racing each other to develop a new class of 2.5D and 3D packages based on various next-generation interconnect technologies. Intel, TSMC and others are exploring or developing ...
This article explores the technology trends in dielectric materials for both 2.5D and 3D packaging, with insights drawn from IDTechEx's market report on the topic, "Materials and Processing for ...
The 3D IC and 2.5D IC Packaging Market is growing due to rising demand for compact, high-performance chips in AI, IoT, and advanced computing applications.Austin, May 14, 2025 (GLOBE NEWSWIRE ...
The choice between 2.5D and 3D design approaches depends largely on the specific application requirements, including size, performance, and integration complexity. The 3DIC Compiler from Synopsys ...
The vision of a 3D IC is truly promising, but some industry watchers believe the 2.5D market is perhaps being too easily dismissed as a stepping stone to true 3D design. 2.5D has the distinct ...
The logic segment is the growing application of 3D IC and 2.5D IC Packaging due to the expansion of smart city projects worldwide, growing safety concerns, and rising demand for improved high ...
Using Tessent Multi-die software, IC design teams can rapidly generate IEEE 1838 compliant hardware featuring 2.5D and 3D IC architectures. “IC design organizations are seeing dramatic spikes in IC ...