ソシオネクストは8月28日、3D ICに対する設計を拡充し、チップレット、2.5D、3Dおよび5.5Dを含むパッケージング技術のラインナップとSoC設計能力を活かした高性能・高品質なソリューションを提供できる体制を整備したことを発表した。

そのうち、今回はデバイス・プロセス部門の注目論文の最後として高密度2.5D実装および3Dトランジスタ垂直積層に向けた3件の取り組みを紹介する。

The 3D IC and 2.5D IC Packaging Market is growing due to rising demand for compact, high-performance chips in AI, IoT, and advanced computing applications.

The transition from 3D to 5D ascension is a transformative journey that invites you to transcend the limitations of the physical world and embrace a higher state of consciousness.

The vision of a 3D IC is truly promising, but some industry watchers believe the 2.5D market is perhaps being too easily dismissed as a stepping stone to true 3D design. 2.5D has the distinct ...

The challenge is that 2.5D/3D devices have thinner dies and higher package processing temperatures. For this reason, the software supports transistor-level analysis, verification, and debugging of ...

Shanghai, China, April 16, 2025--VeriSilicon (688521.SH) today announced the launch of GCNano3DVG, a new ultra-low power graphics processing unit (GPU) IP designed specifically for wearable and other ...