TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...
The Sanand OSAT, established under the government’s India Semiconductor Mission 1.0 (ISM), represents one of the first tangible outputs of India’s push to build a self-reliant semiconductor ecosystem.
In a significant leap for India’s semiconductor ambitions, the country’s first commercially packaged multi-chip module (MCM) rolled out early Wednesday from Kaynes Semicon’s outsourced semiconductor ...
Semiconductor solutions provider Kaynes Semicon’s OSAT facility in Sanand, Gujarat, has dispatched India’s first commercially packaged multi-chip module (MCM) to Alpha & Omega Semiconductor in ...
Parsons is actively working with the DoD to conceptualize a new generation of 3D-printed MCMs building off of the success of the first generation of HERCULES, presented at IDTechEx last year. The ...
The total investment in the OSAT project amounts to Rs 3,307 crore, with contributions from the Centre (Rs 1,653.5 crore), the Gujarat government (Rs 661.4 crore), and Kaynes (Rs 992.1 crore) India's ...
Osram Opto Semiconductors has introduced the first compact laser multi-chip package. The PLPM4 450 module can pack up to 20 blue laser chips into a single "butterfly" package for projection ...
According to a new report from Taiwan, the upcoming A20 chip will cost Apple a massive $280 per unit. This apparently accounts for a year-over-year increase of more than 80% over the A19 chip that ...
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